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Showing posts from November, 2021

Why can't via hole be in pad?

Why can't via hole be in pad? If I want Via in pad, how to do? Many newcomers to PCBs often have this problem when they first encounter it, because the board space is too small, dense devices lead to a small space, can not lead to fan holes, usually choose to punch the holes in the pads, which makes it much easier to connect their own lines, but often do not know what kind of problems will lead to the board? Can this be done? In order to make this issue clearly explained, it will be explained from the following two aspects: 1) Why can't via hole be in pad? 2) Under what circumstances can via holes be punched into pads? Why can't via hole be in pad In the early stage of PCB design, BGA pads are not allowed to have via holes. The main reason is that tin leakage leads to insufficient solder paste on the pads, which leads to virtual welding and unwelding of devices during device welding. Therefore, in general, holes are drilled on devices by leading out first and then drilling