Seektronics

In the past, analysts, consultants and many other experts have tried to estimate the cost of new chips using the latest process technology. They concluded that by the 3-nanometer node, only a few companies could afford it, and by the E-level node, no one might be able to afford it.   Much has changed in the last few process nodes. More and more startups are succeeding in making advanced node chips that cost far less than those highly quoted numbers. Behind those numbers are some broad changes in chip design and manufacturing. Among them:   Many advanced node chips are either highly replicated arrays of multiple cumulative processing elements for AI/ML. These are relatively simple compared to integrating different elements on a single chip, but require characterization of their thermal issues, noise, and various use cases and applications.   Advanced packaging techniques, which have become mainstream since the creation of these early estimates, allow chipmakers to bundle together chips

The integrated circuit is a miniature electronic device or component. Using a certain process, a circuit requires transistors, resistors, capacitors and inductors and other components and wiring interconnections together, made in a small piece or several small semiconductor wafers or dielectric substrate, and then encapsulated in a casing to become a miniature structure with the required circuit function; which all the components in the structure of the structure has been made up of an integral whole, so that the electronic components to the micro-miniaturization, low-power, intelligent and high reliability, it is a big step forward in the circuit with the letter "IC". High reliability has taken a big step forward, it is expressed in the circuit with the letter "IC". IC engineers in their daily study and work will more or less encounter some professional IC vocabulary. In this issue, in alphabetical order, see what are the common IC vocabulary in English abbreviatio