Seektronics

  IC Packaging Technology Brief Overview   IC packaging is the circuit pins on a silicon wafer that are connected to an external connector with wires for connection to other devices. The package form is the housing used to mount the semiconductor IC chip. It has the function of mounting, fixing, sealing, protecting the chip, and enhancing the electrical and thermal performance.   Advanced IC packaging is a major technology highlight of the "More than Moore" era.  When the chip in each node of the chip scaling becomes more difficult and expensive, engineers will put multiple chips into advanced packaging, and no longer have to struggle to shrink the chip.     This article provides a brief overview of the 10 most common terms used in next-generation IC packaging technologies.   2.5D Packaging   2.5D packaging is an advancement of traditional 2D IC packaging technology that allows for finer line and space utilization. In a 2.5D package, the die is stacked or placed side-by-side