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What is the future of chip manufacturing?

The 68th annual IEEE International Conference on Electronic Devices in San Francisco. iEDM is the premier conference for state-of-the-art semiconductor device technology. At this year's conference, organizations including Intel, TSMC, Samsung, IBM, Micron, Shinsei, Sunrise, Applied Materials and countless others, research institutions such as IMEC and CEA-Leti, and then several universities showcased cutting-edge semiconductor technologies. Cutting edge here means not only the most advanced logic processes, but also memory, analog, packaging and many other areas. It is important to stay tuned to this conference because it showcases technologies that will lead to changes in the business of devices, foundries, fabless, equipment, and packaging.   This paper is part of a short series on the many advances, developments and research discussed at IEDM, which will cover advanced logic technologies and advanced packaging. This paper will cover CFET - the next evolution of GAA transistors,