Seektronics

  The brain that controls wafer production   Traditional solutions are often isolated or loosely connected and difficult to scale for additional requirements, while CIM can integrate it all. ITRS 2007 states that semiconductor wafer integration is divided into five parts: fab operations, production equipment, material handling, fab information, control systems and facilities, and CIM-driven fab operations will be the driving force behind the operation of the other parts.   The results of a 1986 Toshiba study showed that using IC-CIM technology to produce 256kbyte DRAM memory circuits improved four manufacturing metrics.   Results of a Toshiba study in 1986   According to other companies, one year after CIM was put into use, equipment downtime was reduced by 45%, equipment setup time was reduced by 38%, equipment utilization was increased by 30%, cycle time was reduced by 23%, scrap was reduced by 22.5%, product yield was increased by 15%, production costs were reduced by 34%, and net p