Seektronics

  The brain that controls wafer production   Traditional solutions are often isolated or loosely connected and difficult to scale for additional requirements, while CIM can integrate it all. ITRS 2007 states that semiconductor wafer integration is divided into five parts: fab operations, production equipment, material handling, fab information, control systems and facilities, and CIM-driven fab operations will be the driving force behind the operation of the other parts.   The results of a 1986 Toshiba study showed that using IC-CIM technology to produce 256kbyte DRAM memory circuits improved four manufacturing metrics.   Results of a Toshiba study in 1986   According to other companies, one year after CIM was put into use, equipment downtime was reduced by 45%, equipment setup time was reduced by 38%, equipment utilization was increased by 30%, cycle time was reduced by 23%, scrap was reduced by 22.5%, product yield was increased by 15%, production costs were reduced by 34%, and net p

  1. From the shape.   1.1 Chip   Yes, this small black silicon chip is the "chip" itself (usually smaller than a thumb, integrated inside the hardware integrated circuits to achieve specific functions). 1.2 Module   The module developed from the above chip looks like this.       From the appearance, the module is much brighter than the chip (at least, you can see the copper foil, the pins), and that black ESP32 chip is inside him.   1.3 Development board   The development board developed by the above module looks like this.   Yes, the part marked ESP-WROOM-32 on the development board is the "module" above. The development board is much more luxurious than the "module" (finally, there are buttons, USB ports, and LEDs), do you want to write a program to light up the LEDs immediately?   2.  Development Mode   Want to light up LED lights? Wait! Let's talk about how to burn the program into the chip, module, and development board.   First of all, it is dif

From a professional point of view, the production process of a chip is extremely complicated and tedious. But in terms of the complete IC industry chain, it is mainly divided into four parts: IC design → IC manufacturing → packaging → testing.   Chip fabrication process.   I. Chip design   Chip belongs to the small size, but great high precision products. To make a chip, design is the first link. The design needs to be done with the help of EDA tools and some IP cores, and finally made into the chip design blueprint needed for processing.   II . sand-silicon separation   All semiconductor processes start with a grain of sand. Because the silicon contained in the sand is the raw material needed to produce the silicon wafer, the "foundation" of the chip. So our first step is to separate the silicon from the sand.     III . silicon purification   After the silicon is separated out, the rest of the material is discarded. The silicon is purified in several steps to achieve the qua