Seektronics

Via in pad   as the name implies, is to hit the hole in the pad, with the increasing integration of electronic products, the components package is getting smaller and smaller, especially in complex PCB design pin spacing is too small, not hit the plate in the hole can not fan out, then you must hit the plate in the hole, from the next layer out of the line.   In the drawing of the PCB, the plate in the hole is nothing special, is over the hole in the pad, but there are several types of PCB production and processing processes, as hardware engineers must understand.   The most common hole in the plate   Is the hole in the pad, the production of PCB does not require a special process, the pad will leave a "hole eye", if the hole eye is too large may cause tin leakage problems, may also lead to false soldering problems, this process is the cheapest and most common, as follows QFN package on the heat sink hole.   Resin plugging hole + copper plating cap   This type of plate-in-the

Why can't via hole be in pad? If I want Via in pad, how to do? Many newcomers to PCBs often have this problem when they first encounter it, because the board space is too small, dense devices lead to a small space, can not lead to fan holes, usually choose to punch the holes in the pads, which makes it much easier to connect their own lines, but often do not know what kind of problems will lead to the board? Can this be done? In order to make this issue clearly explained, it will be explained from the following two aspects: 1) Why can't via hole be in pad? 2) Under what circumstances can via holes be punched into pads? Why can't via hole be in pad In the early stage of PCB design, BGA pads are not allowed to have via holes. The main reason is that tin leakage leads to insufficient solder paste on the pads, which leads to virtual welding and unwelding of devices during device welding. Therefore, in general, holes are drilled on devices by leading out first and then drilling