Seektronics

  Out of stock, price rise, the global lack of chips increasingly intense.   Recently, the global power semiconductor leading Infineon is brewing a new round of product prices, prices or up to 12%! Similarly, the world's largest foundry TSMC also rumored in July will be adjusted upward, the rate of 15 ~ 30%.   And accompany of out of stock rise in price, is the chaos .   Chaos 1: Fakes proliferate   From masks to vaccine passports to chips: almost all products that have been in high demand over the past year or so have inevitably provided opportunities for fraudsters hoping to make easy money by faking them.   The shortage of chips has increased prices, leading companies to place orders with suppliers who do not pass quality checks, thus flooding them with counterfeit goods. Studies have shown that as lead times increase, manufacturers are under pressure to source parts quickly and start sourcing from third-party distributors. Soon, counterfeit products entered the supply chain.  

PCB Cloning is known as PCB Copy or PCB duplication. It is a reversely researching technology based on existing physical PCB boards, to obtain a good electronic product PCB design circuit, as well as the circuit schematic diagram and BOM table. It is the integrated tasks of PCB reverse engineering, IC unlock (also referred das IC crack), PCB prototype and debug, then re-production.   PCB cloning basic steps   1. When you get a PCB, first record on paper the type, parameters and position of all the components, especially the diodes, the direction of the triplet and the direction of the IC gap. It is best to use a digital camera to take two photos of the location of the components. Nowadays, the PCB circuit board more and more advanced above the diode triode some do not pay attention to do not see.   2. Remove all components and remove the tin from the PAD hole. Clean the empty PCB board with ultrasonic wave, and then put it into the scanner. Note that the PCB must be placed horizontally

In the peripheral circuit design of DC-DC BUCK chips, we usually add capacitors or a combination of capacitors + resistors between the BOOT and SW pins, this piece of circuit is called bootstrap circuit, the capacitors and resistors in the bootstrap circuit are called bootstrap capacitors and bootstrap resistors.   What is a bootstrap capacitor?   DCDC Buck chip has a pin called BOOT, and some are called BST. The following is an explanation of the BOOT pin of a DCDC chip. In the external circuit design, a capacitor, generally 0.1uF, is needed between the BOOT and SW pin, and is connected to the driver end of the high-end MOS tube of DCDC.     How does a bootstrap capacitor work?   The following is a block diagram of a DCDC BUCK chip, the top NMOS is called the high-side MOSFET and the bottom NMOS is called the low-side MOSFET.     When the high side MOS tube is turned on, SW is VIN, SW charges and stores energy in the inductor, and the inductor current is rising; when the low side MOS

0 ohm resistor, also known as a bridge resistor, is a special purpose resistor. 0 ohm resistor is a resistor with a very small resistance value, rather than zero resistance value. Two points in the design of the circuit board can not be connected with the printed circuit, often in the front with cross line connection, which is often seen in the ordinary board, in order to make the automatic chip machine and automatic insert machine work normally, with zero resistance instead of cross line. 0 Ohm resistor for span lines on single sided PCBs   A summary of the role of the 0 ohm resistor can include the following: l  No function in the circuit, just on the PCB for debugging convenience or compatible design, etc. l  Can be used as a jumper to avoid high frequency interference (becoming an antenna) caused by using jumpers. l  When the parameters of the matching circuit are uncertain, 0 ohm is used to replace them. In the actual debugging, the parameters are determined and then the specific

In general, the system is always composed of multiple subsystems, which in turn are composed of smaller subsystems, until the subsystems are subdivided into a complex combination of resistors, capacitors, inductors, transistors, integrated circuits, mechanical parts, and other small components, any one of which will be the cause of the system failure. Therefore, the hardware reliability design should consider both the reliability design of a single control unit and the reliability design of the entire control system based on ensuring the reliability of the components.   1. Factors affecting hardware reliability   (1) Component failure.  There are three kinds of component failure: one is the defect of the component itself, such as silicon crack, air leakage, etc.; the second is the processing process, environmental conditions change to accelerate the failure of components and assemblies; the third is the process problems, such as poor welding, screening, etc.   (2) Improper design.  In