Seektronics

  Storage and computation, or computation in storage, refers to the transformation of the traditional von Neumann architecture from a computation-centric design to a data storage-centric design, that is, the use of memory for data computation, thus avoiding the "storage wall" and "power wall" generated by data handling This avoids the "storage wall" and "power wall" generated by data handling, and greatly improves the parallelism and energy efficiency of data. This architecture is especially suitable for end devices requiring large computing power and low power consumption, such as wearable devices, mobile devices, smart homes, etc.   1.  Limitations of the von Neumann architecture    The first is performance.   In the classical von Neumann architecture, data storage and computation are separated, and data is exchanged between processor CPU memory through the data bus. However, due to the different internal structures, processes, and packaging of

  Bare plate welding test procedure   1. After the circuit board is obtained, it is necessary to observe whether the circuit board circuit is damaged or not, and whether the welding plate is damaged or not.   2. Use a multimeter to measure whether there is short circuit between the power supply and the ground and between different power sources;   3, welding the first part of the power supply, and the power debugging successfully;   4. Weld the CPU and peripheral resistance, crystal oscillator and reset circuit again, and test the power supply and ground again after welding to avoid short circuit and thermal breakdown during welding;   Test after welding CPU: It is necessary to confirm that the crystal oscillator can start normally and reset normally. The program can be downloaded and simulated. When debugging, ensure that the corresponding IO port can be set.   IO port can be directly set to light the LED light.   5. Welding SDRAM and debugging.   6. Weld the serial port and connect i

     In general, there are two main rules for laminated design       Each routing layer must have an adjacent reference layer (power source or formation);       T he adjacent main power layer and formation should be kept at a minimum spacing to provide a large coupling capacitance          The following is an example of a stack from two to eight layers:   A single-sided PCB board and double-sided PCB board laminated   For the two-layer board, because the number of layers is small, there is no lamination problem. EMI radiation control is mainly considered from the wiring and layout;   The EMC problem of single-layer and double-layer plates is more and more prominent. The main reason for this phenomenon is that the area of the signal loop is too large, which not only produces strong electromagnetic radiation but also makes the circuit sensitive to external interference. The simplest way to improve the EMC of a line is to reduce the loop area of a critical signal.   Critical signals: From