The integrated circuit is a miniature electronic device or component. Using a certain process, a circuit requires transistors, resistors, capacitors and inductors and other components and wiring interconnections together, made in a small piece or several small semiconductor wafers or dielectric substrate, and then encapsulated in a casing to become a miniature structure with the required circuit function; which all the components in the structure of the structure has been made up of an integral whole, so that the electronic components to the micro-miniaturization, low-power, intelligent and high reliability, it is a big step forward in the circuit with the letter "IC". High reliability has taken a big step forward, it is expressed in the circuit with the letter "IC".
IC engineers in their daily study and work will more or less encounter some professional IC vocabulary. In this issue, in alphabetical order, see what are the common IC vocabulary in English abbreviations!
APCVD： Atmospheric Pressure Chemical Vapor Deposition
ADC： Analog to Digital Convert
ASIC： Application-Specific Integrated Circuit
ASSP： Application-specific standard product
APB： Advanced Peripheral Bus
AHB： Advanced High-Performance Bus
AXI： Advanced Xtensible Interface
APR： Auto place and route
ATPG： Auto Test Pattern Generator
ALU： arithmetic and logic unit
BGA： Ball Grid Array
Semiconductor： It refers to the conductivity at room temperature between the conductor and insulator materials, common semiconductor materials involved in silicon, germanium, gallium arsenide, silicon carbide, gallium nitride and so on. Semiconductor products are mainly divided into integrated circuits, discrete devices, optoelectronic devices and sensors four categories
BE： Back End， usually refers to the back-channel layout phase of IC design, and is not a paradigm usage.
BIST: Build in System Test, generates test code inside the chip, analyzes the results of the test, a common process in DFT
BLE： Blue Low Energy
BSD： Blind-Spot Detection
BPSG： Borophospho silicate glass
Test: After IC packaging, it is necessary to measure the functional and electrical parameters of the IC to screen out unqualified products, and to find out the quality defects in the process of chip design, manufacturing and packaging through the test results.
CAD： Computer-Aided Design
CAN： Controller Area Network，ISO internationally standardized serial communication protocols
CDC： clock domain crossing Asynchronous clock timing check, an important step in digital design
COVERAGE： Coverage, a term commonly used in digital verification, mainly code coverage and functional coverage, etc.6
CTS：Clock tree synthesis
CPLD： Complex Programmable Logic Device
CMOS：A technology used to manufacture chips for large-scale integrated circuits or chips made with this technology.
CM3:ARM Cortex M senor CPU
Chiplet： Core, a pre-fabricated wafer with a specific function that can be combined and integrated
CP： Circuit Probing、Chip Probing
CIM： Computer Integrated Manufacturing
CMOS： complementary metal-oxide-semiconductor
CMP： Chemical Mechanical Polishing
CRT： cathode ray tube
CVD： Chemical Vapor Deposition
DAC： Digital to Analog Convert
DC： design compiler Synopsys
D code： Data code
DV： Design Verification
Delay： refers to the delay of components and can also be used to refer to the delay of the project schedule
DFT： Design for Test A design methodology used to enhance chip testability, an important step in the digital IC process
DMA： Direct Memory Access
DRAM： Dynamic Random Access Memory
DRC： Design Rule Check，It is to check whether the layout of the IC Design conforms to the design rules after the IC Design has been laid out.
DSP： Digital Signal Processing
DUT： Design under test
DUV： design under verification
DIP： Dual Inline Packages
ECO： Engineering Change Order Later in the project, changes to the chip design can only be made at the gate level
EDA（Electronic Design Automation）：It refers to the use of computer software to complete the design of large-scale integrated circuits, simulation, verification and other processes of the design approach, the integration of graphics, computational mathematics, microelectronics, topological logic, materials science and artificial intelligence and other technologies
EEPROM： Electrically Erasable Programmable Read-Only Memory
ERC： Electronic Rule Check ,It is to check the electrical compliance of the layout after the IC Design has been laid out.
FPGA： Field Programmable Gate Array
FE: Front End usually refers to the front-end logic design phase of IC design, and is not a standardized usage.
FM: Formal Formal verification, netlist and verilog for comparison.
Fabless: Chip design company, also known as DesignHouse, fabless IC enterprise business model, the use of this model of manufacturers only chip design, R & D, applications and sales, and will be outsourced to the wafer manufacturing, packaging and testing of professional wafer manufacturing, packaging and testing vendors
Foundry: Chip foundry, refers to the foundry business of the chip manufacturing and processing plant, responsible for the design of the completed chip produced
FSDB: commonly used waveform file format, open with Verdi
FLASH： Flash EEPROM Memory
FULL CHIP：fullchip level,Commonly used in digital front-end design and verification, referring to system-level and chip-level
FT： Final Test
FC： Flip Chip
GPU： Graphics Processing Unit
GPIO： General Purpose Input Output
GLS：gate-level simulation
GAA： Gate-All-Around FET
HDMI: High Definition Multimedia Interface
HDL： Hardware Description Language
HVL： Hardware Verification Language
IC： Integrated Circuit
l code： Instruction code
IP： Intellectual Property
IT： Information Technology
Layout： Layout, the final generated layout of the chip, similar to the design drawings in the construction industry
LPS： low power simulation
LVDS： Low Voltage Differential Signaling，A low-swing differential signaling technology that enables signals to be transmitted at hundreds of Mps over differential PCB pairs or balanced cables, with low-amplitude and low-current drive outputs for low noise and power consumption.
LVS： Layout versus Schematic
LUT： Look-Up-Table
LED： light emitting diode
LDW： Lane-Departure Warining,
LPCVD： low Pressure Chemical Vapor Deposition
LNA： Low Noise Amplifier
MCU： Micro controller unit
MIPI： Mobile Industry Processor Interface
MIPS： A RISC-based instruction architecture
MCDF： Multi-Channel Data Shaper
MEMS： Micro-Electro-Mechanical System
MOP： Moving Object Detection
MSB： Most Significant Bit，The highest valid bit of a multi-bit data, the corresponding concept is LSBMSI: Medium Scale Integration, medium-sized integrated circuit, logic gates 11 (100 or transistors 101) 1k.
MOS：metal-oxide-semiconductor，metal oxide semiconductor
MPW： Multi-Project Wafer
MOSFET：metal-oxide-semiconductor field effect transistor
NDR： Non-Default Route
NRE：Non Recuuring Engineering
NFC： Near Field Communication
NoC： Network on Chip
NOR Flash: Faster reads, slower writes
Nand Flash: Slower reads, faster writes
OCP： Open Core Protocol
OSC: Oscillator
OSD： One Screen Display
OPC： Optical and Process Correction
PA： Power Amplifier
PBA： Path-based analyze
PCB： Printed Circuit, The finished boards of printed circuits or printed circuits are called printed circuit boards or printed circuit boards, also known as printed boards
PCM: Phase change memory
PD： Physical design Physical design, generally refers to the layout of the digital backend
PDK： Process Design Kit， A process design kit is a set of documents used within the IC industry to model the manufacturing process of a design tool used to design an integrated circuit.
Perl： Commonly used scripting languages in digital IC design
PLL： Phase Locked Loop
PLCC：(Plastic Leadless Chip Carrier)
PIC： Programmable interrupt controller
PV： Physical verification
PAE： process antenna effect
PMIC： Power Management IC
PT： prime time synopsis, Company's static timing analysis tool
Python： Commonly used scripting language, now used a lot in AI, hugely popular
POR： Power On Reset
PECVD： Plasma Enhancement Chemical Vapor Deposition
PSG： Phosphosilicate glass
PVD： Physical Vapor Deposition
Parallel Computing: A type of computation where many operations are carried out simultaneously.
Priority Encoder: A circuit or algorithm that compresses multiple binary inputs into a smaller number of outputs
PWM： Pulse width modulation
P&R： Automated Place and Route of a circuit using an EDA tool.
Q: Q fixed point number format
QFP：(Quad Flat Package)
QFN：(Quad Flat No-leadPackage)
RAID: Redundant array of disks
RAM： Random Access Memory
REGRESSION： Regression testing simply means running all the test cases over and over again until there are no errors for a stable period of time.
ROM： Read Only Memory
RTL： Register Transformation Level
RISC： Reduced Instruction System Computer
RF： Radiation Frequency
SBC: Single board computers
SEM: Scanning electron microscope
SPI: Synchronous 4 wire master/slave interface
SoC： System on Chip，I.e., system-on-chip, is a chip circuit that integrates the key components of the system on a single chip that can realize the complete system functions.
SPEC： specification
specSI： Signal Integrity
SIP: System In Package
SDR: Software-defined radio
SRAM： Static Random Access Memory
STA：Static Timing Analysis
SV： System Verilog
SPI: Serial Peripheral Interface
SOP： Small Out-Line Package
SOJ： Small Outline J-lend Package
SERDES: Serializer/deserializer
Shift Register: Set of registers that shifts bits one position at a time
SIMD: Single instruction multiple data
SSI： Small Scale Integration
Schmitt Trigger: Comparator circuit with hysteresis
Spice: Open-source analog electronic circuit simulator
TCL： Tool Command Language
TEOS： tetraethyl ortho-silicate
TAB： Tape Automated Bonding
TCP： Tape Carrier Packages
TLB： Translation lookaside buffer
UART： Universal Asynchronous Receiver/Transmitter
UCDB： Unified coverage database
UCLI： Unified Command-Line Interface
UDP： User-defined primitive
UJT： Unijunction Transistor
ULSI： Ultra Large Scale Integration
UVM： Universal Verification Methodology
V2V： Via to Via
VCO： Voltage Controlled Oscillator
VCS： Verilog Compiled Simulator
VDMOS： Vertical Double-diffused MOSFET
VG： Vapour Growth
VGA： Video Graphic Array
VLD： Visible Laser Diode
VLIW: Very long instruction-level parallelism
VLS： Vapour-Liquid-Solid
VLSI： Very large scale integration
VPE： Vapour Phase Epitaxy (or Epitaxial)
VR： Voltage Regulator
VRAM：Video RAM，(Random Access Memory)
VSI： Virtual Socket Interface
VTCMOS： Variable Threshold voltage CMOS，Technique for dynamically controlling the effectiveness threshold voltage by applying a substrate voltage to the MOS transistor
WAN: Wide area network
WAT： Wafer Acception Test
WC： worst-case
WCDMA： WideBand Code Division Multiple Access
WDT: Watch Dog Timer 39、
WGL： Waveform Generation Language
WLF： Wave Log File
WLM： Wire Load Model
WNS： Worst negative slack
WSI： Wafer Scale Integration
XPS： X-ray Photoelectron Spectroscopy
Yield： Yield rate, yield rate
ZD： Zener Diode
ZIP： Zig-Zag Inline Packages
ZigBee： Short-range wireless communication technology, Protocol of ZigBee
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