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Samsung's chips profit down 97%

South Korea's largest company has been grappling with a historic plunge in memory prices as consumers cut back on gadget purchases amid soaring interest rates and inflation. Inventories have piled up, forcing double-digit price declines that have exacerbated losses.   The business environment deteriorated significantly in the fourth quarter as demand weakened due to the global economic slowdown," the company said in a press release Tuesday, adding that in the semiconductor business, earnings are expected to fall by a quarter in the first quarter as plant utilization declined.   The world's largest memory chip maker, which supplies displays and semiconductors for Apple's iPhone, said it sees "a potential recovery in mobile demand in the second half of the year" as customers seek gadgets with more storage space. The Galaxy device maker said smartphone market demand could contract in 2023, dragged down by mass-market handsets.   Profit at Samsung's key chip

One Word: 2022 Connector Industry Acquisitions

  Movement continues in the interconnect industry as connector companies expanded their services, capabilities, products, and supply chains with 2022’s round of acquisitions. Interconnects related to military and aerospace, fiber optics, Test & Measurement, as well as materials access and manufacturing expertise, are among the motivating factors in the year’s acquisitions. Since the 1980s, mergers and acquisitions have occurred frequently in the electronics industry. The pace of consolidation has greatly slowed, but the year brought a few notable moves.   Connector Industry Acquisitions by Month   January 2022   Neutrik Americas Acquires Major Custom Cable Inc.   Neutrik Americas (NAM), a wholly owned subsidiary of Neutrik AG and a member of  the Neutrik Group , acquired its long-time business partner and customer, Major Custom Cable (MCC). MCC is recognized as a premier manufacturer of data and communication cables. Peter Milbery, president of Neutrik Americas, said, “Neutrik has

The What Is CIM And Explain How Does It Work? That Wins Customers

  The brain that controls wafer production   Traditional solutions are often isolated or loosely connected and difficult to scale for additional requirements, while CIM can integrate it all. ITRS 2007 states that semiconductor wafer integration is divided into five parts: fab operations, production equipment, material handling, fab information, control systems and facilities, and CIM-driven fab operations will be the driving force behind the operation of the other parts.   The results of a 1986 Toshiba study showed that using IC-CIM technology to produce 256kbyte DRAM memory circuits improved four manufacturing metrics.   Results of a Toshiba study in 1986   According to other companies, one year after CIM was put into use, equipment downtime was reduced by 45%, equipment setup time was reduced by 38%, equipment utilization was increased by 30%, cycle time was reduced by 23%, scrap was reduced by 22.5%, product yield was increased by 15%, production costs were reduced by 34%, and net p

How Do You Package A PCB? Explained

In order to ensure the quality of PCBA, PCBA transportation and storage should also strictly comply with the operating specifications.       1 .  Anti-static   Do a good job of PCBA anti-static measures, the use of appropriate containers, tools, etc.   2 .  Use suitable transportation tools   Tools should ensure good, such as wheels, frames, etc.; abnormal should be reported in time to repair, prohibit the use of "with injury", so as to avoid the transport of semi-finished products fall, extrusion and other situations.   3 .  Check the common tools   Transport tools, storage tools, and workstations such as storage before the operation to do a good job of cleaning, do not allow debris, slag, etc.. Avoid damage to the PCBA caused by mutual friction.   4 .  Marking important information   Transportation, and storage of PCBA containers, and tools should be well marked on the car, record product-related information, to avoid misplacement, mixing, etc.   5 .  Stacking requirements