Seektronics

  Chip area size   Chip size is determined by the chip designer and even the entire chip design team to communicate together, the chip is definitely not how big you want to design how big, there are many aspects of the cost and benefits involved, in general, under the same conditions of the architecture, the larger the chip design specifications, the higher the performance, but subject to various conditions, the chip can never be expanded without limit.   For example, a PC chip and cell phone chip design standards are different, the size of an Intel CPU in more than 100 square millimeters is very normal, high-end i7 and to the strong processor to more than 200 square millimeters is also commonplace because the PC is larger, better heat dissipation space, the chip specifications can be made larger to improve performance.   For cell phone chips, a Snapdragon or Kirin processor can only be controlled within a few dozen square millimeters of area, because the space inside the phone inch by

  1. What is an integrated circuit?   An integrated circuit (IC) is a miniature electronic device or component. Using a semiconductor process, the transistors, resistors, capacitors, inductors, and other components and wiring required in a circuit are fabricated on one or more semiconductor wafers and then packaged in a housing to form a miniature structure with the desired circuit function. Integrated circuits are usually denoted by the letters "IC" and their function is to process the input information.   Let's take a look at the circuit diagram and circuit board of a discrete device.   Imagine if you could miniaturize the circuits composed of these discrete semiconductor devices and then make them together？ As early as 1952, British scientist G. W. A. Dummer proposed the idea of integrated circuits, and in 1958 TI's Clair Kilby's research group invented the first integrated circuit, containing 12 components, using germanium semiconductors. The next few decades

  IC Packaging Technology Brief Overview   IC packaging is the circuit pins on a silicon wafer that are connected to an external connector with wires for connection to other devices. The package form is the housing used to mount the semiconductor IC chip. It has the function of mounting, fixing, sealing, protecting the chip, and enhancing the electrical and thermal performance.   Advanced IC packaging is a major technology highlight of the "More than Moore" era.  When the chip in each node of the chip scaling becomes more difficult and expensive, engineers will put multiple chips into advanced packaging, and no longer have to struggle to shrink the chip.     This article provides a brief overview of the 10 most common terms used in next-generation IC packaging technologies.   2.5D Packaging   2.5D packaging is an advancement of traditional 2D IC packaging technology that allows for finer line and space utilization. In a 2.5D package, the die is stacked or placed side-by-side