Skip to main content

What is an Integrated Circuit (ICs) ?

 1.What is an integrated circuit?

 

An integrated circuit (IC) is a miniature electronic device or component. Using a semiconductor process, the transistors, resistors, capacitors, inductors, and other components and wiring required in a circuit are fabricated on one or more semiconductor wafers and then packaged in a housing to form a miniature structure with the desired circuit function. Integrated circuits are usually denoted by the letters "IC" and their function is to process the input information.

 

Let's take a look at the circuit diagram and circuit board of a discrete device.

 


Imagine if you could miniaturize the circuits composed of these discrete semiconductor devices and then make them together? As early as 1952, British scientist G. W. A. Dummer proposed the idea of integrated circuits, and in 1958 TI's Clair Kilby's research group invented the first integrated circuit, containing 12 components, using germanium semiconductors. The next few decades saw rapid development of integrated circuits and now integrated chips containing billions of transistors are commonplace, with chips like the Huawei Kirin 1020 and the Apple A14, which use a 5nm advanced process, reaching more than 10 billion transistors.

 



 

MCU (Microcontroller Unit) as an example to further understand the structure of the chip, micro control unit, also known as a single chip microcomputer (Single Chip Microcomputer ) or a single chip, the chip contains a microprocessor (CPU), and the memory (memory), counter (Timer), PLL, A/D conversion, UART, DMA and other peripheral interfaces Integrated on a single chip to form a chip-level computer for different applications to do different combinations of control.

 

The diagram below shows the structure of the MCU chip.

 


 

Through the chip layout and microscope magnification picture to understand the chip inside what kind of length, the following figure is a variety of different process chip layouts. A number of different process chip layoutsThen look at the microscopic photos of the IC chip.

 

 



 

Chip microscope photos

 


 

2. Integrated Circuit Industry Chain

 

The IC industry consists of three major industries: design, manufacturing, and packaging, in addition to additional industries such as semiconductor materials, devices, equipment, and design software tools.

 

In the early days, most of the semiconductor companies were Integrated Device Manufacturers (IDM), which were responsible for IC design, manufacturing, packaging, testing and sales. Typical IDM factories include Intel, TI, Motorola, Samsung and other companies.Due to Moore's Law, the design and production of semiconductor chips became increasingly complex and costly, and a single semiconductor company often could not afford the high R&D and production costs from upstream to downstream. IC design) and DESIGN SERVICE model (chip design service provider). Well-known foundries (Foundry, generally responsible for only one part of manufacturing, packaging or testing) are TSMC, UMC, Charter, SMIC, Sunrise, SPIL, Changdian Technology, Huatian Technology, etc. Well-known FABLESS are Qualcomm, MediaTek, Broadcom, Huawei, AMD, etc. Well-known DESIGN SERVICE are ARM, Imagination, Synopsys, Cadence, Mentor Graphics, etc. The following figure shows the division of labor of the three major industries.

 

3. IC general classification

 

ICs can be divided into analog ICs and digital ICs in terms of circuit characteristics, such as operational amplifiers are analog ICs and encoder chips are digital ICs, but of course, many chips are designed with a mixture of both. The degree of customization can be divided into semi-custom ICs and fully customized ICs, FPGA / CPLD belongs to semi-custom chips, typically characterized by user-programmable change of internal logic, ASIC (special-purpose integrated circuit) belongs to fully customized chips, general-purpose CPU, GPU is also generally fully customized chips, they are characterized by once the design and manufacture of the circuit is fixed, can no longer be changed. In fact, regardless of whether it is analog, digital, or a mix of both, any custom chip is an ASIC. soc (system-on-chip or system-on-chip) can be implemented in FPGAs or designed as an ASIC, which generally includes digital logic design and analog circuit design.

 

4. Digital IC development process

 

The general flow of digital IC R&D is as follows: firstly, the specification is customized (set the target), then the functions in the specification are described in a hardware description language, whether the functions realized by the code meet the expectation needs to be simulated and verified, and if the functions of the code are found to be inconsistent with the specification, the design needs to be modified until the functions are correct after the verification is passed, the RTL code is integrated into the process-related gate-level circuit, and the gate-level netlist needs to do After verification, the RTL code will be synthesized into process-related gate-level courses, and the gate-level netlist will be verified by functional verification and formal comparison, and the layout and wiring of the back-end can be carried out only after the verification is passed.

 

5. Integrated IC design-related knowledge

 

Integrated IC involves a wide range of knowledge, human energy is limited, a person is unlikely to master all the knowledge, so we need to be selective in learning, the work needs to use those points of knowledge to learn those points of knowledge first, learn while using, grow in practice. Chip design-related knowledge points are rough as follows. System knowledge Computers, communication, information, control, and other disciplines.Programming knowledge Verilog/VHDL Scripting language (TCL, Perl, Python, etc.)Circuit knowledge analog, digital, analog-digital hybrid, RFIC, MMIC.Tool knowledge cadence, Synopsys and other software tools.Process knowledge Component characteristics and models, process principles and procedures.Linux knowledge of Linux basic operation.

Comments

Popular posts from this blog

The biggest problem with the latest 56 semiconductor manufacturers suspend orders, price increased, and long lead time. How can you fix it?

 Following the suspension of MCU orders by ELAN , Holtek Semiconductor issued a notice on 21st April suspending orders with immediate effect. The price of various semiconductors, especially MCUs, has risen as a result of factors such as the tightness of 8-inch wafer foundries. The demand for MCUs is so high that many major MCU manufacturers at home and abroad are operating at full capacity, but supply still exceeds demand. In its notice, Holtek  Semiconductor stated that Suspension of orders for 2022 Subject: Orders with delivery dates in 2022 are suspended with immediate effect.   Description: 1. The wafer fabs and packaging houses have advised that there will be another wave of price increases soon - price increases of 15%-30%. 2. The fabs are expected to provide 2022 production numbers by early May and will announce 2022 order acceptance rules when confirmed.   3. expected to resume accepting orders for 2022 by mid-May. 4. 2022 orders that have received deposits will be rescheduled

Understanding of DC-DC buck bootstrap circuit

In the peripheral circuit design of DC-DC BUCK chips, we usually add capacitors or a combination of capacitors + resistors between the BOOT and SW pins, this piece of circuit is called bootstrap circuit, the capacitors and resistors in the bootstrap circuit are called bootstrap capacitors and bootstrap resistors.   What is a bootstrap capacitor?   DCDC Buck chip has a pin called BOOT, and some are called BST. The following is an explanation of the BOOT pin of a DCDC chip. In the external circuit design, a capacitor, generally 0.1uF, is needed between the BOOT and SW pin, and is connected to the driver end of the high-end MOS tube of DCDC.     How does a bootstrap capacitor work?   The following is a block diagram of a DCDC BUCK chip, the top NMOS is called the high-side MOSFET and the bottom NMOS is called the low-side MOSFET.     When the high side MOS tube is turned on, SW is VIN, SW charges and stores energy in the inductor, and the inductor current is rising; when the low side MOS

2022 global chip shortage continues: ST、NXP、ADI、XILINX、ONSEMI、DIODES... latest trends

Under the influence of the epidemic and various emergencies around the world, the global chip industry fell into a shortage of stock in 2021. Now it has been a year, and the shortage of chips seems to have not eased. Below, we have collated the latest market developments of the original chip manufacturers such as ST, Renesas, NXP, ADI, ON Semiconductor, Microchip, Qualcomm, etc., so that you can have a good idea of the market situation. ST: Large shortage of high-end products and automotive chips Most stockists have been selling off since the prices of ST  products have fallen back, but this month has seen a small rebound. For example, STM8S003F3P6TR  and STM32F103VCT6 , two pieces of material, have seen a small price increase. It is worth noting that the market price of ST's brake system chips has recently soared, and other automotive chips have also risen, and there is still a large shortage of high-end products and automotive chips, and delivery times are still long.   In additi

Teach you 5 ways to identify and avoid counterfeit electronic components in a second

In the process of purchasing electronic components, the most worrying thing for buyers is not the price, but the quality of the product. There are a variety of IC chips on the market, of all kinds, and without paying attention to the distinction, it is sometimes difficult to see the difference between various materials, whether it is true or false, new or refurbished. The following is a compilation of some methods to identify genuine and fake chips, for your reference. Common chip counterfeiting methods Material A counterfeit material A Original manufacturer's tailor loose material: the original packaging has been disassembled or is no longer available, but product functionality and yield may be lower due to storage time or handling process, etc. Original manufacturer scrap or defective products: mainly products that have not passed factory inspection by the original manufacturer, such as scrap products after reliability testing, poor packaging quality, bad test products, etc. Orig

9 effective ways to improve your electronic components specification for approval

1. Let purchasers find manufacturers to provide specifications, safety information, environmental protection information, insurance information - E-document 2. Verify that the information is true and complete, such as the applicable period of the document, so as not to be fooled by the manufacturer. 3. Let the buyer find the manufacturer to provide samples, specifications, safety information, environmental information, insurance information - Paper files 4. Environmental test: send several samples to the environmental laboratory for ROSH halogen test. 5. Electrical specifications and high-temperature testing - e.g. electrolytic capacitors :  A: measuring capacity and deviation withstand voltage, PIN foot tin is good B: go through the production line to see if the capacitors are deformed after the high temperature of the furnace and if the capacity and the deviation voltage are okay. 6. Body size check - e.g. electrolytic capacitors . Body height and diameter, PIN pin spacing, PIN pin d