The Secret Guide To Common Chip Peripheral Literacy

1. UART

UART is called Universal Asynchronous Receiver-Transmitter, which is usually used for a communication connection between chips and external devices. When we say serial port in embedded, it usually means UART port. Embedded systems often use the UART port to connect to the COM port of the host PC (or to connect to the USB port of the host after converting the UART to USB) for debugging, so that the printf function in the embedded system can be redirected to print to the display of the host.

The data transmission format of UART is as follows.

During the transmission process, the UART sender sends out the byte data bit by bit in serial, and the receiver receives the data bit by bit and then reorganizes it into byte data. the UART transmission rate is measured by Baud Rate (Baud Rate).

2. I2C

I2C is a simple, bi-directional two-wire synchronous serial bus developed by Philips, which requires only two bus lines: a serial data line SDA and a serial clock line SCL, and supports bi-directional communication. The main features of I2C are as follows.

Support for writing data to or reading data from an external I2C slave device as an I2C master device.

Support for generating transmit or receive terminals.

Support for configuring the frequency of the serial clock line SCL via registers.

Each device connected to the bus can be identified using a unique address.

Actual multi-host bus with conflict detection and arbitration to prevent data corruption when two or more hosts initiate the data transfer at the same time.

3. I2S

I2S, known as Inter-IC Sound, is a bus standard developed by Philips for audio data transmission between digital audio devices, which is dedicated to data transmission between audio devices and is widely used in various multimedia systems. In this protocol, data signals and clock signals are transmitted along separate wires, thus avoiding signal distortion caused by time differences.

4. SPI

SPI works in a master-slave mode, usually with one master device and one or more slave devices, and requires at least four wires (for full-duplex method) or three wires (for half-duplex mode), namely SDI (data input), SDO (data output), SCK (clock), and CS (chip select). The GPIOs are the GPIOs of the GPIOs, and the CS (chip select).

5. GPIO

GPIO is called General Purpose Input/Output, general purpose input/output interface. Each I/O pin can be directly controlled by software programmable configurable registers (software control mode) or directly controlled by hardware interface signals (IOF mode), and can be used as CLK Generator, Chip Select, etc.

6. PWM

PWM, known as Pulse-Width Modulation, is a common module in MCU. PWM uses the digital output of MCU to control analog circuits and is widely used in many fields of measurement, communication, power control, and switching.

7. WDT

WDT is a timer circuit that has one input, commonly known as "watchdog", and one output, which is connected to the MCU's global reset. During normal operation, the MCU will "feed" the WDT at regular intervals, and if it does not "feed" for more than a specified period of time (such as when the program is running away), the WDT will trigger a timing timeout, after which a reset signal will be sent. After the timeout, a reset signal will be sent to the MCU to reset the MCU globally and prevent the MCU from crashing. In short, the role of the watchdog is to prevent the program from dead loops or program runaway and other error situations.

8. RTC

RTC, known as Real-Time Clock, is a common module in MCU, mostly using a crystal oscillator with high precision as the clock source.RTC is usually in the power-on domain in the MCU system, running at a fixed low-speed clock, so it can provide absolutely accurate time reference, so it is called a real-time clock.

9. PMU

PMU is a commonly used module in MCU. PMU is usually in the power-on domain in the MCU system and controls the power on/off of other parts of the MCU SoC to achieve higher power conversion efficiency and lower power consumption.

Comments

The biggest problem with the latest 56 semiconductor manufacturers suspend orders, price increased, and long lead time. How can you fix it?

Following the suspension of MCU orders by ELAN , Holtek Semiconductor issued a notice on 21st April suspending orders with immediate effect. The price of various semiconductors, especially MCUs, has risen as a result of factors such as the tightness of 8-inch wafer foundries. The demand for MCUs is so high that many major MCU manufacturers at home and abroad are operating at full capacity, but supply still exceeds demand. In its notice, Holtek Semiconductor stated that Suspension of orders for 2022 Subject: Orders with delivery dates in 2022 are suspended with immediate effect. Description: 1. The wafer fabs and packaging houses have advised that there will be another wave of price increases soon - price increases of 15%-30%. 2. The fabs are expected to provide 2022 production numbers by early May and will announce 2022 order acceptance rules when confirmed. 3. expected to resume accepting orders for 2022 by mid-May. 4. 2022 orders that have received deposits will be rescheduled

Understanding of DC-DC buck bootstrap circuit

In the peripheral circuit design of DC-DC BUCK chips, we usually add capacitors or a combination of capacitors + resistors between the BOOT and SW pins, this piece of circuit is called bootstrap circuit, the capacitors and resistors in the bootstrap circuit are called bootstrap capacitors and bootstrap resistors. What is a bootstrap capacitor? DCDC Buck chip has a pin called BOOT, and some are called BST. The following is an explanation of the BOOT pin of a DCDC chip. In the external circuit design, a capacitor, generally 0.1uF, is needed between the BOOT and SW pin, and is connected to the driver end of the high-end MOS tube of DCDC. How does a bootstrap capacitor work? The following is a block diagram of a DCDC BUCK chip, the top NMOS is called the high-side MOSFET and the bottom NMOS is called the low-side MOSFET. When the high side MOS tube is turned on, SW is VIN, SW charges and stores energy in the inductor, and the inductor current is rising; when the low side MOS

2022 global chip shortage continues: ST、NXP、ADI、XILINX、ONSEMI、DIODES... latest trends

Under the influence of the epidemic and various emergencies around the world, the global chip industry fell into a shortage of stock in 2021. Now it has been a year, and the shortage of chips seems to have not eased. Below, we have collated the latest market developments of the original chip manufacturers such as ST, Renesas, NXP, ADI, ON Semiconductor, Microchip, Qualcomm, etc., so that you can have a good idea of the market situation. ST: Large shortage of high-end products and automotive chips Most stockists have been selling off since the prices of ST products have fallen back, but this month has seen a small rebound. For example, STM8S003F3P6TR and STM32F103VCT6 , two pieces of material, have seen a small price increase. It is worth noting that the market price of ST's brake system chips has recently soared, and other automotive chips have also risen, and there is still a large shortage of high-end products and automotive chips, and delivery times are still long. In additi

Teach you 5 ways to identify and avoid counterfeit electronic components in a second

In the process of purchasing electronic components, the most worrying thing for buyers is not the price, but the quality of the product. There are a variety of IC chips on the market, of all kinds, and without paying attention to the distinction, it is sometimes difficult to see the difference between various materials, whether it is true or false, new or refurbished. The following is a compilation of some methods to identify genuine and fake chips, for your reference. Common chip counterfeiting methods Material A counterfeit material A Original manufacturer's tailor loose material: the original packaging has been disassembled or is no longer available, but product functionality and yield may be lower due to storage time or handling process, etc. Original manufacturer scrap or defective products: mainly products that have not passed factory inspection by the original manufacturer, such as scrap products after reliability testing, poor packaging quality, bad test products, etc. Orig

9 effective ways to improve your electronic components specification for approval

1. Let purchasers find manufacturers to provide specifications, safety information, environmental protection information, insurance information - E-document 2. Verify that the information is true and complete, such as the applicable period of the document, so as not to be fooled by the manufacturer. 3. Let the buyer find the manufacturer to provide samples, specifications, safety information, environmental information, insurance information - Paper files 4. Environmental test: send several samples to the environmental laboratory for ROSH halogen test. 5. Electrical specifications and high-temperature testing - e.g. electrolytic capacitors : A: measuring capacity and deviation withstand voltage, PIN foot tin is good B: go through the production line to see if the capacitors are deformed after the high temperature of the furnace and if the capacity and the deviation voltage are okay. 6. Body size check - e.g. electrolytic capacitors . Body height and diameter, PIN pin spacing, PIN pin d

Seektronics

Search This Blog