Seektronics

  The brain that controls wafer production   Traditional solutions are often isolated or loosely connected and difficult to scale for additional requirements, while CIM can integrate it all. ITRS 2007 states that semiconductor wafer integration is divided into five parts: fab operations, production equipment, material handling, fab information, control systems and facilities, and CIM-driven fab operations will be the driving force behind the operation of the other parts.   The results of a 1986 Toshiba study showed that using IC-CIM technology to produce 256kbyte DRAM memory circuits improved four manufacturing metrics.   Results of a Toshiba study in 1986   According to other companies, one year after CIM was put into use, equipment downtime was reduced by 45%, equipment setup time was reduced by 38%, equipment utilization was increased by 30%, cycle time was reduced by 23%, scrap was reduced by 22.5%, product yield was increased by 15%, production costs were reduced by 34%, and net p

In order to ensure the quality of PCBA, PCBA transportation and storage should also strictly comply with the operating specifications.   　   1 .  Anti-static   Do a good job of PCBA anti-static measures, the use of appropriate containers, tools, etc.   2 .  Use suitable transportation tools   Tools should ensure good, such as wheels, frames, etc.; abnormal should be reported in time to repair, prohibit the use of "with injury", so as to avoid the transport of semi-finished products fall, extrusion and other situations.   3 .  Check the common tools   Transport tools, storage tools, and workstations such as storage before the operation to do a good job of cleaning, do not allow debris, slag, etc.. Avoid damage to the PCBA caused by mutual friction.   4 .  Marking important information   Transportation, and storage of PCBA containers, and tools should be well marked on the car, record product-related information, to avoid misplacement, mixing, etc.   5 .  Stacking requirements

  1. From the shape.   1.1 Chip   Yes, this small black silicon chip is the "chip" itself (usually smaller than a thumb, integrated inside the hardware integrated circuits to achieve specific functions). 1.2 Module   The module developed from the above chip looks like this.       From the appearance, the module is much brighter than the chip (at least, you can see the copper foil, the pins), and that black ESP32 chip is inside him.   1.3 Development board   The development board developed by the above module looks like this.   Yes, the part marked ESP-WROOM-32 on the development board is the "module" above. The development board is much more luxurious than the "module" (finally, there are buttons, USB ports, and LEDs), do you want to write a program to light up the LEDs immediately?   2.  Development Mode   Want to light up LED lights? Wait! Let's talk about how to burn the program into the chip, module, and development board.   First of all, it is dif

  Protel 99 SE provides 32 signal layers, including the Top layer, Bottom layer and 30  M iddle layer.   Top signal layer: also known as the component layer, mainly used to place components, for multilayer boards can be used for wiring.   Mid Signal Layer: up to 30 layers, used to lay signal lines in multilayer boards.   The bottom signal layer : also known as the solder layer, mainly used for wiring and soldering, and sometimes can also be placed on the components.   Silkscreen layer: The silkscreen layer is mainly used for placing printed information, such as component outline and labeling, various comment characters, etc. Protel 99 SE provides two silkscreen layers, Top Overlay and Bottom Overlay. Generally, various annotation characters are placed on the top screen printing layer, and the bottom screen printing layer can be closed.   Top silkscreen layer: used to mark the projected outline of the component, the component's mark, nominal value or model number and various comment

  555 Timer   If you've played with electronic circuits, odds are you know about the 555 timer integrated circuit, said to be the world's best-selling integrated circuit, with billions sold. Designed by analog IC wizard Hans Camenzind, the 555 has been called one of the greatest chips of all time.   Tediously sanding the epoxy package to expose the chip (below) and identifying the chip as a 555 timer. signets released the 555 timer in mid-1972, and the chip below has a date code of January 1973 (7304), so it must be one of the earliest 555 timers. Oddly enough, it is not labeled as a 555, so it may be a prototype or internal version. I took detailed photos of the die, which are discussed in this blog post.     A brief description   The 555 timer has hundreds of applications, from timers or latches to anything from voltage controlled oscillator or modulator operation. The following diagram illustrates how the 555 timer works as a simple oscillator. Inside the 555 chip, three res