Skip to main content

10% price hike from 1.JAN. 2023! Marvell, SILICON LABS, AMD

Recently, Marvell Electronics (Marvell) issued a notice letter. The letter states that due to increased costs on the supplier side and other additional expenses, the price of its products will increase by 10% effective January 1, 2023.

 


In the notice letter, Marvell said that product supply issues have been alleviated and that it is now gradually reducing its backlog of orders. As of December 1, the lead time for most products has been reduced to 26 weeks (the 16-week lead time for Fibre Channel HBAs will remain unchanged). However, due to supplier cost increases and additional costs, Myman must increase product prices by 10 percent, effective January 1, 2023. However, the notification letter does not specify the relevant products and models, nor does it specify whether the price increase is across the board.

 



 

In addition to Marvell, AMD also issued a price increase letter in November, announcing price increases for its Xilinx Xilinx-branded FPGA products.

 

Prices will increase by 8% for Xilinx series products, 25% for Spartan 6 series products, and no change for Versal series products. New orders, inventory, backlog, and distribution orders will be transacted based on the price increase, effective January 9, 2023.

 



 

In addition, SILICON LABS (CoreTech) also sent notification letters to its customers and partners that it will increase product prices as supply chain costs continue to rise due to the global capacity crisis and general inflation in almost all industries.

 



 

Starting January 1, 2023, CoreTech will increase the prices of all its existing product lines and Series1 series products, including the existing backlog of orders, the specific rate of increase is not disclosed. However, the price increase does not include 1Cs/Ocs, 2Cs/Soc and other new product lines. The current chip market overall in the downward channel, more in the environment of inventory, and demand is clearly differentiated, there are not many cases of large-scale price increases to the segmentation of the local, small price increases.

Comments

Popular posts from this blog

The biggest problem with the latest 56 semiconductor manufacturers suspend orders, price increased, and long lead time. How can you fix it?

 Following the suspension of MCU orders by ELAN , Holtek Semiconductor issued a notice on 21st April suspending orders with immediate effect. The price of various semiconductors, especially MCUs, has risen as a result of factors such as the tightness of 8-inch wafer foundries. The demand for MCUs is so high that many major MCU manufacturers at home and abroad are operating at full capacity, but supply still exceeds demand. In its notice, Holtek  Semiconductor stated that Suspension of orders for 2022 Subject: Orders with delivery dates in 2022 are suspended with immediate effect.   Description: 1. The wafer fabs and packaging houses have advised that there will be another wave of price increases soon - price increases of 15%-30%. 2. The fabs are expected to provide 2022 production numbers by early May and will announce 2022 order acceptance rules when confirmed.   3. expected to resume accepting orders for 2022 by mid-May. 4. 2022 orders that have received deposits will be rescheduled

Understanding of DC-DC buck bootstrap circuit

In the peripheral circuit design of DC-DC BUCK chips, we usually add capacitors or a combination of capacitors + resistors between the BOOT and SW pins, this piece of circuit is called bootstrap circuit, the capacitors and resistors in the bootstrap circuit are called bootstrap capacitors and bootstrap resistors.   What is a bootstrap capacitor?   DCDC Buck chip has a pin called BOOT, and some are called BST. The following is an explanation of the BOOT pin of a DCDC chip. In the external circuit design, a capacitor, generally 0.1uF, is needed between the BOOT and SW pin, and is connected to the driver end of the high-end MOS tube of DCDC.     How does a bootstrap capacitor work?   The following is a block diagram of a DCDC BUCK chip, the top NMOS is called the high-side MOSFET and the bottom NMOS is called the low-side MOSFET.     When the high side MOS tube is turned on, SW is VIN, SW charges and stores energy in the inductor, and the inductor current is rising; when the low side MOS

2022 global chip shortage continues: ST、NXP、ADI、XILINX、ONSEMI、DIODES... latest trends

Under the influence of the epidemic and various emergencies around the world, the global chip industry fell into a shortage of stock in 2021. Now it has been a year, and the shortage of chips seems to have not eased. Below, we have collated the latest market developments of the original chip manufacturers such as ST, Renesas, NXP, ADI, ON Semiconductor, Microchip, Qualcomm, etc., so that you can have a good idea of the market situation. ST: Large shortage of high-end products and automotive chips Most stockists have been selling off since the prices of ST  products have fallen back, but this month has seen a small rebound. For example, STM8S003F3P6TR  and STM32F103VCT6 , two pieces of material, have seen a small price increase. It is worth noting that the market price of ST's brake system chips has recently soared, and other automotive chips have also risen, and there is still a large shortage of high-end products and automotive chips, and delivery times are still long.   In additi

Teach you 5 ways to identify and avoid counterfeit electronic components in a second

In the process of purchasing electronic components, the most worrying thing for buyers is not the price, but the quality of the product. There are a variety of IC chips on the market, of all kinds, and without paying attention to the distinction, it is sometimes difficult to see the difference between various materials, whether it is true or false, new or refurbished. The following is a compilation of some methods to identify genuine and fake chips, for your reference. Common chip counterfeiting methods Material A counterfeit material A Original manufacturer's tailor loose material: the original packaging has been disassembled or is no longer available, but product functionality and yield may be lower due to storage time or handling process, etc. Original manufacturer scrap or defective products: mainly products that have not passed factory inspection by the original manufacturer, such as scrap products after reliability testing, poor packaging quality, bad test products, etc. Orig

9 effective ways to improve your electronic components specification for approval

1. Let purchasers find manufacturers to provide specifications, safety information, environmental protection information, insurance information - E-document 2. Verify that the information is true and complete, such as the applicable period of the document, so as not to be fooled by the manufacturer. 3. Let the buyer find the manufacturer to provide samples, specifications, safety information, environmental information, insurance information - Paper files 4. Environmental test: send several samples to the environmental laboratory for ROSH halogen test. 5. Electrical specifications and high-temperature testing - e.g. electrolytic capacitors :  A: measuring capacity and deviation withstand voltage, PIN foot tin is good B: go through the production line to see if the capacitors are deformed after the high temperature of the furnace and if the capacity and the deviation voltage are okay. 6. Body size check - e.g. electrolytic capacitors . Body height and diameter, PIN pin spacing, PIN pin d