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What is an Integrated Circuit (ICs) ?

  1. What is an integrated circuit?   An integrated circuit (IC) is a miniature electronic device or component. Using a semiconductor process, the transistors, resistors, capacitors, inductors, and other components and wiring required in a circuit are fabricated on one or more semiconductor wafers and then packaged in a housing to form a miniature structure with the desired circuit function. Integrated circuits are usually denoted by the letters "IC" and their function is to process the input information.   Let's take a look at the circuit diagram and circuit board of a discrete device.   Imagine if you could miniaturize the circuits composed of these discrete semiconductor devices and then make them together? As early as 1952, British scientist G. W. A. Dummer proposed the idea of integrated circuits, and in 1958 TI's Clair Kilby's research group invented the first integrated circuit, containing 12 components, using germanium semiconductors. The next few decades

How many types of IC packages are there?

  IC Packaging Technology Brief Overview   IC packaging is the circuit pins on a silicon wafer that are connected to an external connector with wires for connection to other devices. The package form is the housing used to mount the semiconductor IC chip. It has the function of mounting, fixing, sealing, protecting the chip, and enhancing the electrical and thermal performance.   Advanced IC packaging is a major technology highlight of the "More than Moore" era.  When the chip in each node of the chip scaling becomes more difficult and expensive, engineers will put multiple chips into advanced packaging, and no longer have to struggle to shrink the chip.     This article provides a brief overview of the 10 most common terms used in next-generation IC packaging technologies.   2.5D Packaging   2.5D packaging is an advancement of traditional 2D IC packaging technology that allows for finer line and space utilization. In a 2.5D package, the die is stacked or placed side-by-side

The Secret Guide To Common Chip Peripheral Literacy

  1. UART   UART is called Universal Asynchronous Receiver-Transmitter, which is usually used for a communication connection between chips and external devices. When we say serial port in embedded, it usually means UART port. Embedded systems often use the UART port to connect to the COM port of the host PC (or to connect to the USB port of the host after converting the UART to USB) for debugging, so that the printf function in the embedded system can be redirected to print to the display of the host.   The data transmission format of UART is as follows.   During the transmission process, the UART sender sends out the byte data bit by bit in serial, and the receiver receives the data bit by bit and then reorganizes it into byte data. the UART transmission rate is measured by Baud Rate (Baud Rate).   2. I2C   I2C is a simple, bi-directional two-wire synchronous serial bus developed by Philips, which requires only two bus lines: a serial data line SDA and a serial clock line SCL, and sup

What is a AI chip? Storage and computing in one - AI chip architecture in the post-Moore era

  Storage and computation, or computation in storage, refers to the transformation of the traditional von Neumann architecture from a computation-centric design to a data storage-centric design, that is, the use of memory for data computation, thus avoiding the "storage wall" and "power wall" generated by data handling This avoids the "storage wall" and "power wall" generated by data handling, and greatly improves the parallelism and energy efficiency of data. This architecture is especially suitable for end devices requiring large computing power and low power consumption, such as wearable devices, mobile devices, smart homes, etc.   1.  Limitations of the von Neumann architecture    The first is performance.   In the classical von Neumann architecture, data storage and computation are separated, and data is exchanged between processor CPU memory through the data bus. However, due to the different internal structures, processes, and packaging of