Seektronics

  What is the ARM Architecture   The ARM architecture, formerly known as AdvancedRISCMachine (earlier: AcornRISCMachine), is a 32-bit Reduced Instruction Set (RISC) processor architecture that is widely used in many embedded system designs. Due to its energy-saving features, the ARM processor is well suited for mobile communications, in line with its primary design goal of low power consumption.   ARM processors can be found in many consumer electronics products, from portable devices (PDAs, cell phones, multimedia players, handheld video games, and computers) to computer peripherals (hard drives, desktop routers) and even in military installations such as missile-based computers. It is found in military facilities such as bullet-loaded computers. There are also a number of ARM-based design derivatives, including Marvell's XScale architecture and Texas Instruments' OMAP family of products.   ARM Architecture Diagram   The following figure shows the ARM architecture diagram. It

Recently, Marvell Electronics ( Marvell ) issued a notice letter. The letter states that due to increased costs on the supplier side and other additional expenses, the price of its products will increase by 10% effective January 1, 2023.   In the notice letter, Marvell said that product supply issues have been alleviated and that it is now gradually reducing its backlog of orders. As of December 1, the lead time for most products has been reduced to 26 weeks (the 16-week lead time for Fibre Channel HBAs  will remain unchanged). However, due to supplier cost increases and additional costs, Myman must increase product prices by 10 percent, effective January 1, 2023. However, the notification letter does not specify the relevant products and models, nor does it specify whether the price increase is across the board.     In addition to Marvell, AMD also issued a price increase letter in November, announcing price increases for its Xilinx Xilinx-branded FPGA products.   Prices will increase

  The main process of front-end design   1.  D etermine the specifications   Chip specifications, also like a list of features, is the customer to the chip design company (called Fabless, waferless design company) proposed design requirements, including the chip needs to achieve specific functional and performance requirements.   2. Define the architecture   Fabless comes up with a specific implementation architecture and the functions of each module based on the specifications proposed by the customer.   3.  HDL coding   Use hardware description language (VHDL, Verilog HDL, industry companies generally use the latter) to describe the module function in code to achieve, that is, the actual hardware circuit function is described by HDL language to form RTL (register transfer level) code.   4.  Simulation verification   Simulation verification is to check the correctness of the coding design, and the criteria for the verification is the specification developed in the first step. See if t

Via in pad   as the name implies, is to hit the hole in the pad, with the increasing integration of electronic products, the components package is getting smaller and smaller, especially in complex PCB design pin spacing is too small, not hit the plate in the hole can not fan out, then you must hit the plate in the hole, from the next layer out of the line.   In the drawing of the PCB, the plate in the hole is nothing special, is over the hole in the pad, but there are several types of PCB production and processing processes, as hardware engineers must understand.   The most common hole in the plate   Is the hole in the pad, the production of PCB does not require a special process, the pad will leave a "hole eye", if the hole eye is too large may cause tin leakage problems, may also lead to false soldering problems, this process is the cheapest and most common, as follows QFN package on the heat sink hole.   Resin plugging hole + copper plating cap   This type of plate-in-the

  Description of the phenomenon.   A plastic enclosure product with an I/O cable was found to exceed the radiation emission limit when conducting the radiation emission test specified in the EMC standard, specifically at 160 MHz. the cause of its radiation exceedance needs to be analyzed and appropriate countermeasures are given.     Reason Analysis   This product has only one PCB, which has a crystal with a frequency of 16MHz. It can be seen that the 160MHz radiation should be related to the crystal (Note: it does not mean that the radiation exceeds the standard is caused by the direct radiation of the crystal, may be multiplier generated). Figure 1 shows the product's local PCB layout, from Figure 1, it is clear that the 16MHz crystal is arranged right at the edge of the PCB.   Figure 1 The product's local PCB layout of the actual diagram   In signal lines or high-speed devices and the laboratory between the reference grounding plate, there is an electric field distribution o